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With the continuous development of online shopping, analyzing the competitiveness of products in the fierce market competition is becoming increasingly crucial to position their own product development. However, the information overload brought by the network development makes it getting difficult to obtain the accurate competitiveness information. Therefore, competitiveness analysis research to combine with the perceived helpfulness study needs urgent solution. Furthermore, deviations exist in the three common methods of perceived helpfulness research. Finally, the traditional information fusion analysis only analyzes the advantages and disadvantages of products in competitiveness analysis without taking account of the competitive environment.

This study puts forward a novel prediction model of perceived helpfulness in conjunction of unsupervised learning and sentiment analysis techniques, to conduct the comparison with pros and cons of congeneric products.

This paper adopts Wilcoxon test to demonstrate the significant rectification of our competitiveness analysis to the traditional methods. It is noted that the positive reviews of the products in this study impact more on product word of mouth and competitiveness than negative ones.

To sum up, the results of this study benefit businesses in locating their dynamic market position with competitors in practice and exploring new method for long-term development strategic planning.

This paper aims to propose a modified full-additive method (MFAM) to fabricate fine copper lines for high density interconnection (HDI) printed circuit boards (PCBs). In addition, the surface of the fine copper lines is treated with a brown oxidation process to obtain good adhesion between the copper and the dielectric resin.

Fine copper lines fabricated by MFAM were observed to evaluate the undercut quality, in comparison to undercut quality of copper lines fabricated by the semi-additive method and the subtractive method. The effect of the thickness of the dry film on the quality of the copper plating was investigated to obtain the regular shape of fine lines. The fine copper lines treated with the brown oxidation process were also examined to generate a coarse surface microstructure to improve the adhesion between the copper and the dielectric resin. The cross section and surface of as-fabricated fine copper lines were characterized using an optical microscope, a scanning electron microscope and an atomic force microscope.

MFAM has the potential to fabricate high-performance fine copper lines for HDI PCBs. Undercut of as-fabricated fine copper lines could be prevented to meet the design requirement of impedance. In addition, fine copper lines exhibit enough adhesive force to laminate with dielectric resin after the brown oxidation process.

MFAM, with the advantages of high efficiency and being a facile process, is developed to fabricate high-quality fine copper lines for industrial HDI PCB manufacture.

This paper aims to introduce a method based on the optimizer of the particle swarm optimization (PSO) algorithm to improve the efficiency of a Kriging surrogate model.

PSO was first used to identify the best group of trend functions and to optimize the correlation parameter thereafter.

The Kriging surrogate model was used to resolve the fuselage optimization of an unmanned helicopter.

The optimization results indicated that an appropriate PSO scheme can improve the efficiency of the Kriging surrogate model.

Both the STANDARD PSO and the original PSO algorithms were chosen to show the effect of PSO on a Kriging surrogate model.

The purpose of this paper is to form good cutting qualities in glass-epoxy material for opening flexible areas of rigid-flex printed circuit boards (PCB) by ultraviolet (UV) laser cutting.

The cut width and cut depth of glass-epoxy materials were both observed to evaluate their cutting qualities. The heat affected zone (HAZ) of the glass-epoxy material was also investigated after UV laser cutting. The relationships between the cut width and the parameters of various factors were analyzed using an orthogonal experimental design.

The cut width of the glass-epoxy material gradually increased with the increment of the laser power and Z-axis height, while cutting speed and laser frequency had less effect on the cut width. Optimal parameters of the UV laser process for cutting glass-epoxy material were obtained and included a laser power of 6W, a cutting speed of 170 mm/s, a laser frequency of 50 kHz and a Z-axis height of 0.6 mm, resulting in an average cut width of 25 μm and small HAZ.

Flexible areas of rigid-flex PCBs are in good agreement with the cutting qualities of the UV laser. The use of a UV laser process could have important potential for cutting glass-epoxy materials used in the PCB industry.

Data service (DS) is a special software service that enables data access in cloud environment and provides a unified data model for cross-origination data integration and data sharing. The purpose of the work is to automatically compose DSs and quickly generate data view to satisfy users' various data requirements (DRs).

The paper proposes an automatic DS composition and view generation approach. DSs are organized into DS dependence graph (DSDG) based on their inherent dependences, and DSs can be automatically composed using the DSDG according to user's DRs. Then, data view will be generated by interpreting the composed DS.

Experimental results with real cross-origination data sets show the proposed approaches have high efficiency and good quality for DS composition and view generation.

The authors propose a DS composition algorithm and a data view generation algorithm according to users' DRs.

The purpose of this paper is to form copper coin-embedded printed circuit board (PCB) for high heat dissipation.

Manufacturing optimization of copper coin-embedded PCB involved in the design and treatment of copper coin, resin flush removal and flatness control. Thermal simulation was used to investigate the effect of copper coin on heat dissipation of PCB products. Lead-free reflow soldering and thrust tests were used to characterize the reliable performance of copper coin-embedded PCB.

The copper coin-embedded PCB had good agreement with resin flush removal and flatness control. Thermal simulation results indicated that copper coin could significantly enhance the heat-dissipation rate by means of a direct contact with the high-power integrated circuit chip. The copper coin-embedded PCB exhibited a reliable structure capable of withstanding high-temperature reflow soldering and high thrust testing.

The use of a copper coin-embedded PCB could lead to higher heat dissipation for the stable performance of high-power electronic components. The copper coin-embedded method could have important potential for improving the design for heat dissipation in the PCB industry.

Optimized plating conditions, included proper designs of insulating shield (IS), auxiliary cathode (AC) and different patterns, contribute to the uniformity enhancement of copper deposition.

Plating experiments were implemented in vertical continuous plating (VCP) line for manufacturing in different conditions. Multiphysics coupling simulation was brought to investigate and predict the plating uniformity improvement of copper pattern. In addition, the numerical model was based on VCP to approach the practical application.

With disproportionate current distribution, different plating pattern design formed diverse copper thickness distribution (CTD). IS and AC improved plating uniformity of copper pattern because of current redistribution. Moreover, optimized plating condition for effectively depositing more uniformed plating copper layer in varied pattern designs were derived by simulation and verified by plating experiment.

The comparison between experiment and simulation revealed that multiphysics coupling is an efficient, reliable and of course environment-friendly tool to perform research on the uniformity of pattern plating in manufacturing.

The purpose of this paper is to present a weakly supervised learning method to perform health evaluation and predict the remaining useful life (RUL) of rolling bearings.

Based on the principle that bearing health degrades with the increase of service time, a weak label qualitative pairing comparison dataset for bearing health is extracted from the original time series monitoring data of bearing. A bearing health indicator (HI) quantitative evaluation model is obtained by training the delicately designed neural network structure with bearing qualitative comparison data between different health statuses. The remaining useful life is then predicted using the bearing health evaluation model and the degradation tolerance threshold. To validate the feasibility, efficiency and superiority of the proposed method, comparison experiments are designed and carried out on a widely used bearing dataset.

The method achieves the transformation of bearing health from qualitative comparison to quantitative evaluation via a learning algorithm, which is promising in industrial equipment health evaluation and prediction.

The method achieves the transformation of bearing health from qualitative comparison to quantitative evaluation via a learning algorithm, which is promising in industrial equipment health evaluation and prediction.

The purpose of this paper is to establish an accurate model to quantify the effect of conductor roughness on insertion loss (IL) and provide improved measurements and suggestions for manufacturing good conductive copper lines of printed circuit board.

To practically investigates the modified model of conductor roughness, three different kinds of alternate oxidation treatments were used to provide transmission lines with different roughness. The IL results were measured by a vector net analyzer for comparisons with the modified model results.

An accurate model, with only a 1.8% deviation on average from the measured values, is established. Compared with other models, the modified model is more reliable in industrial manufacturing.

This paper introduces the influence of tiny roughness structures on IL. Besides, this paper discusses the effect of current distribution on IL.

The purpose of this study is to investigate the synergism of convection, current density distribution and additives by numerical simulation and electrochemical experiments for good throwing power (TP) of copper electro-deposition in printed circuit board (PCB) manufacture.

The flow field of THs and current density distribution on various AR of THs are calculated and analyzed. Meanwhile, corresponding simulation is used to study the performance of plating electrolytes on TP. Two electrochemical parameters, overpotential (η) and potential difference (△η), are chosen to evaluate the electrochemical properties of different plating solutions by galvanostatic measurement and potentiodynamic cathode polarization at different rotating speeds.

By combining both the results of simulation and practical plating, these two electrochemical properties of electrolytes exhibit significant impact to the system at varied conditions. Especially, the electrolyte with higher polarizing η and △η values lead to the elevated TP for AR of more than 2:1.

The harring cell model is built as a bridge between the theoretical and experimental study for control of uniformity of plating THs in PCB manufacturing. This dual-parameter evaluation is validated to be a promising decisive method to guide the THs plating with particular AR in industry.